Stock code
300554

Lang.


Chinese


English


Japanese

Precision tool for the Semicon

PRODUCT

Picture Album

    Precision tool for the Semicon
    Hubless Blades

    Pre：CMP-DISK
    Next：Back Grinding Diamond Wheels (for Silicon Wafers)
    ABOUT
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    PRODUCT
    Electroplated diamond wire
    Precision tool for the Semicon
    Grinding wheels for Prdcision
    Semiconductor Equipment
    Diamond & CBN grinding wheel
    Cutting Fluid(Cutting Coolant)
    EQUIPMENT
    Instrument
    Equipment
    INVESTOR
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    TALENT
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    1500264308

    Contact Us

    Address:Zecheng Road 77, Chunhua street, Jiangning District, Nanjing, China

    Tel:+86-25-84154668 84154777-8000

    Fax:+86-25-84154558

    E-Mail: sanchao@diasc.com.cn

    Copyright © 2002-2022 南京三超新材料股份有限公司 版权所有 苏ICP备12002878号-1

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