Details:

Edge grinding wheel for bevel machining of semiconductor material substrates.

Thanks to a design featuring a uniform layer of fine grains and high-precision finishing technology, this grinding wheel makes high-quality, high-precision machining possible with minimal chipping.

Both outer-circumference machining and notch machining wheels are available in three types: single-groove, multi-groove, and composite rough finishing.

Features

· Even and ne diamond layer minimizes processing damage.

· Wear resistant bond with a high grain holding force is used to achieve high shap eretention and a long life.

· Highly precise slotted shape and nishing technology support various wafer shapes.

· Copper-less supported.

SPECIFICATION:

Unit:mm